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    產(chǎn)品資料
    
        
    
            














    
    
    
        
    
            
    
                
    
                    
    
                        
                        
    
                            
    
                            
    臺(tái)灣產(chǎn)千住錫膏
    
                            
    產(chǎn)品型號(hào)：M705-S101HF-S4
    
                            
    產(chǎn)品品牌：千住金屬
    
                            
    
                                
                                13543272580
                            
    

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	臺(tái)灣產(chǎn)千住錫膏
    

    
     

    

    
	臺(tái)灣產(chǎn)千住錫膏 ECO SOLDER PASTE M705-S101HF-S4 

    

    
	1.Scope 

    

    
	This specification covers the solder paste, 

    

    
	ECO SOLDER PASTE M705-S101-S4, using lead-free solder alloy, used for 

    

    
	wiring connection and so on, of electrical and electronic parts. 

    

    
	2.Standard 

    

    
	２.1Chemical composition of solder alloy（Test method：STM-9） 

    

    
	Composition and impurities are prescribed as following tables 

    

    
	
		
    
			
				
    
					Composition ( mass% ) 
				
    
			    		
		
    
		
    
			
				
    
					Ａｇ 
				
    
			    		
			
				
    
					Ｃｕ 
				
    
			    		
			
				
    
					Ｓｎ 
				
    
			    		
		
    
		
    
			
				
    
					3.0 ± 0.1 
				
    
			    		
			
				
    
					0.50 ± 0.05 
				
    
			    		
			
				
    
					Balance 
				
    
			    		
		
    
	    

    

    
	2.2Performance and standard 

    

    
	
		
    
			
				
    
					Items 
				
    
			    		
			
				
    
					Performance                 Standard 
				
    
			    		
			
				
    
					Test Method 
				
    
			    		
		
    
		
    
			
				
    
					Appearance 
				
    
			    		
			
				
    
					It shall not have separated flux,and shall be in a smooth pastestate. 
				
    
			    		
			
				
    
					STM-1 
				
    
				
    
					 
				
    
			    		
		
    
		
    
			
				
    
					Flux content (mass%) 
				
    
			    		
			
				
    
					11.5 ± 1.0 
				
    
			    		
			
				
    
					STM-5 
				
    
			    		
		
    
		
    
			
				
    
					Viscosity of solderpaste (Pa s) 
				
    
			    		
			
				
    
					190 ± 30 
				
    
			    		
			
				
    
					STM-7-8 
				
    
			    		
		
    
		
    
			
				
    
					Grain size of powder 
				
    
				
    
					（um） 
				
    
			    		
			
				
    
					36 ～25 
				
    
			    		
			
				
    
					STM-12-4 
				
    
			    		
		
    
		
    
			
				
    
					Copper plate corrosion test 
				
    
			    		
			
				
    
					Shall be passed 
				
    
			    		
			
				
    
					STM-28-1 
				
    
			    		
		
    
		
    
			
				
    
					Insulation resistance 
				
    
			    		
			
				
    
					Ordinary state 1 × 10 or more After humidifying 1 × 10 or more 
				
    
			    		
			
				
    
					STM-30-8 
				
    
			    		
		
    
		
    
			
				
    
					Solution resistance 
				
    
			    		
			
				
    
					100 or more 
				
    
			    		
			
				
    
					STM-32 
				
    
			    		
		
    
		
    
			
				
    
					Reflow property 
				
    
			    		
			
				
    
					No unmelted solder nor black product shall be permissibl 
				
    
			    		
			
				
    
					STM-34 
				
    
			    		
		
    
	    

    

    
	 

    
            
    
        
    
    
    


    





        
    
    
    

    




    
    
    
        
        
    
    

    



    
        
        
        
        
    

    
    
    

    
	
    
		 		
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